ALD Systems

The Advanced ALD system is a viscous flow-type reactor for ultra thin film deposition. The growth process is controlled by a Windows-based software package. The base model is equipped with two gas lines and handles wafer size up to 12 ". With a compact footprint, all hardware is enclosed in a negative pressure cabinet for safety more information.

Applications
— High k dielectrics
— Nanocoatings
— Surface modification layers
— Device encapsulations
— Photonic crystals

Optional add-on components
— Remote plasma source
— Ozone delivery system
— Quartz crystal monitor
— Quadruple mass spectrometer
— Real-time temperature monitor
— Ellipsometer
— LoadLock

Specifications
— Operation Vacuum: 1 Torr to UHV
— 2 Heated Gas Lines (can be expanded to 12)
— Gas injection mode: bubbler and direct draw
— Sample size: up to 4 in standard, optional 12in
— Substrate heater: up to 500°C, optional higher temp